A desoldering pump, also known as a solder sucker or solder vacuum, is a tool used in mobile phone repairing to remove solder from electronic components and circuit boards. It is commonly used when replacing or repairing components that are soldered onto the circuit board. The desoldering pump creates suction to extract molten solder, allowing for the safe and efficient removal of components. 




Here's how a desoldering pump is used in mobile phone repair:

Component Removal: When a faulty or damaged component needs to be replaced, the desoldering pump is used to remove the solder holding the component in place. The component's leads or pins are heated, usually with a soldering iron, until the solder melts. While the solder is in a liquid state, the desoldering pump is positioned over the molten solder, and the plunger or trigger is activated, creating suction. The pump quickly sucks up the molten solder, removing it from the circuit board and freeing the component.


Circuit Board Repair: Desoldering pumps are also useful in repairing circuit boards. When repairing broken or damaged traces, connectors, or other circuitry on the board, the desoldering pump can be used to remove excess solder and clean the area for rework. This enables precise soldering and the establishment of reliable connections.


SMD Component Removal: Surface-mounted devices (SMDs) are commonly found in mobile phones and other electronic devices. These components have solder joints that are often too small or inaccessible for traditional desoldering methods. In such cases, a desoldering pump designed specifically for SMDs, known as a hot air desoldering station, can be used. This station combines the use of hot air to heat the solder and a desoldering pump to extract the molten solder simultaneously, allowing for the safe removal of SMDs.


When selecting a desoldering pump for mobile phone repairing, consider the following factors:

Suction Power: Look for a desoldering pump with sufficient suction power to quickly and effectively remove molten solder. A stronger suction capability ensures efficient desoldering.


Durability and Heat Resistance: Mobile phone repairs often involve working with high temperatures. Choose a desoldering pump made from heat-resistant materials that can withstand the heat generated during desoldering without melting or deforming.


Nozzle Size: The size of the nozzle on the desoldering pump determines its compatibility with different component sizes. Ensure that the nozzle is appropriate for the components you typically work with in mobile phone repair.


Ease of Use and Maintenance: Consider the ergonomics and ease of operation of the desoldering pump. Look for features such as comfortable grips, convenient trigger or plunger mechanisms, and easy disassembly for cleaning and maintenance.

A desoldering pump is an indispensable tool in mobile phone repairing, allowing for efficient and precise removal of soldered components. It helps prevent damage to circuit boards and facilitates successful repairs and component replacements.